JENOPTIK Polymer Systems GmbH

Am Sandberg 2
07819 Triptis
Germany

Phone: +49 36482 45-0
Fax: +49 36482 45-111

http://www.jenoptik-ps.de

sales@jenoptik-ps.de

Company Contacts
Department/ Name Address

Dipl.-Ing. Wolfgang Mueller Telefon: +49 36482 45-0
info@jenoptik-ps.de

Company Figures
Number of employees 100-499
Area of business Design, Research and Development Services

Manufacturing Services

Moulding and Extrusion

Language: German Language: English Company Profile

Company Profile
Our company is well-known for pushing the technological limits for opto-electronic and opto-mechanical systems and components which are used in medical technology, sensor technology, and information technology. Particularly, our solutions for the production of components with non-spherical geometries are the basis for innovative products. We are a technology-driven company and we provide our customers with our know-how.

Along the way to being an application oriented system provider, our costumers additionally benefit from special polymer-specific technologies. The synergy among the various steps along the fully consolidated process chain from optical components, to assembly and packaging, to system integration are already apparent. Technological restrictions along the process chain, which have been partly unknown, are acknowledged already in the design of optical systems and enable new approaches in the development of products.

For years now, JENOPTIK Polymer Systems GmbH and its employees have gained an annual turnover of several Mil. EUR. Worldwide, we carry out approx. 60 development projects per year.

Product Information
12.02 Assembly
Assembly and Packaging Technology 15.09.2008

With assembly and packaging technology we expand the idea of a continuous system.

Depicting complex optical systems in a process chain, offers innovative possibilities. Compensation and micro-assembly, based on assembly and packaging technology, present general solutions for opto-electronic and opto-mechanical systems in the process chain.

All technological steps permit synergies, from wafer dicing to chip bonding and encapsulation, up to active positioning of optical components with extreme precision (<<10 µm).

Compact system design can be realized in consistent high quality from prototype to series fabrication.

All steps necessary for the system are carried out in a class 100 clean room environment. These steps include chip bonding, encapsulation, active positioning, and the 100% end test.

This continuity allows for a compact system construction of optical components and modules along side electronic component (sensor chip, LED, etc.).

Services:
Layout design
Sampling and prototyping
Series production, including SMD insertion
Sewing service
Material logistic

Available Technologies:
Wafer dicing
Chip bonding
Gold wire bonding
Aluminum wire bonding
Encapsulation
Opto-packaging
Separation
Final test

12.08 Coating

12.45 Tooling
Tooling 15.09.2008

In our modern tooling department, we lay the groundwork for the production of high quality products.

We are able to produce highly precise tools which we can maintain and repair during production because of our qualified employees and modern machine equipment.

This guarantees steady series production and meeting the required delivery.

The following technologies are available to us:
Wire erosion
Vertical erosion
Milling and drilling technology
Finishing
Surface grinding and cylindrical grinding
Coordinate grinding
Ultra precision diamond turning

15.03.07 Injection-moulding
2-Component-Injection Molding 15.09.2008

During this process, different or differently colored plastics are manufactured and formed to complex parts in one process flow.

We use this procedure extensively to produce, for example, complex frame parts with incorporated optical elements, such as lenses, prisms, or plane surfaces in a partly or fully automatic work flow.

Using this technology, the advantages of plastic as a material can be further realized. Micro-optical elements can be easily integrated into a complex mechanical component, thereby removing a costly assembly processes.

This process is particularly advantageous for the production of complex parts in large quantities. The excess expenditure involved in preparing the intricate injection molds and machines is amortized within a large scale.

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